We provide the most professional design and service

Our company was established in 2006 as a small manufacturer of equipment, specializing in semiconductor lithography mask alignment of development and manufacturing of the exposure and the exposure source, the light box from the optical exposure within the design to complete various types of exposure the company after years of efforts have been developed entirely completed and shipped many customers at home and abroad, deep acclaim.

  • Mask aligner

    High yield automatic exposure machine, alignment process can produce 250 or more per hour, no registration process can produce 350 or more per hour, the wafer transfer automatic machines for the automatic input and output, the output of the industry’s highest , twice the other brands models.

  • Exposure source

    Optional light intensity flyback type power supply to the light intensity inside the box detectors do feedback control signal, the light intensity output enables long-time stable, uniform beam generated by the array of lenses, making pattern transfer can effectively reduce the exposure light diffraction.

  • Mercury lamp power supply

    Digital display panel output power and voltage and current values, internal electromagnetic contactor do overload protection, rear connectors output power box fan, light boxes and overtemperature protection interlock circuit, good operating performance, good stability, high durability, the most suitable production line.

  • Components

    There is no content, do not know what to write, you just write it to occupy layout. But in many ways, when we catch the Bund sidewalk, formal dance, eventually everybody will applaud, I built this company, Cool !!

The company officially shipped the first UV LED exposure source in July 2020. read more ›
The Company automatic exposure machine for the 2015 Shanghai SEMICON Date 3/17 3/19, Display industry's highest yield models, read more ›
Dutch lithography equipment maker ASML second-quarter profit increase, raising the full-year revenue forecast to 50 billion euros, due to the increase in the second quarter revenue to show a profit read more ›
The company participated in the 2013 International Optoelectronics Exhibition, exhibition Date: 6/18 1-6 / 20 Venue: Nangang Exhibition Hall, Booth: K229, welcome customers to visit. read more ›
Applied Materials (Applied Materials) in 2011, ranking the world's semiconductor plant, gave way to Dutch lithography equipment maker supplier ASML, 2012 return to top spot again in 2012, Applied Materials read more ›
Memory manufacturer Winbond announced to spend NT $ 630 million to buy Powerchip SCIENCE Taiwan exposure machine to cope with the needs of process scaling. read more ›
Lithography giant ASML apply to the Ministry of Economy R & D subsidies, grants will be 800 million yuan, China and Asia Linkou park inaugurated the new plant will be read more ›
Semiconductor lithography equipment maker ASML After obtaining three major semiconductor customers to invest NT $ 200 billion, announced and then further upstream tied pile to 1.95 billion euros (equivalent to read more ›
TSMC recently named Great American Semiconductor Equipment Business lei (KLA-Tencor) electron beam (E-beam) partners technically one of the devices, in addition to Mapper Lithography and IMS. 7 nm process in read more ›
FAQ More
Will you be able to buy exposure to the source of our machine assembly to re-stage delivery to customer?

If your machine with our product no business conflicts, welcome to buy our exposure source.

When will a suitable alignment of the lens?

Fragments do wafer alignment, the two lenses because spacing restrictions, can not see the left and right images simultaneously, using a suitable lens, moving left and right to adjust the alignment of the lens to watch the situation, it can be used in conjunction with a quick scan station bit rate speed up.

After exposure source lighting, power supply display power value has been low for a long time still can not reach the set value, what is there fault?

After mercury lamps, light bulbs need to be increase in temperature, the mercury has evaporated into a gaseous state, the power to reach the set value, if the wind speed is too strong heat caused by the lamp does not heat up, the power can not be increased, the intensity of the beam will be very weak.

Will I just metering gap resistive material at different exposure characteristics, there are models for it?

We have a simple exposure, there is no image registration function, it may be suitable for your application.

Placing the wafer to use what tools?

Wafer placement available flat mouth forceps wafer edge, if the line of particulate tolerate relatively high process can even upload glove hand pick and place wafers.

Can I resist have I-line H-line two kinds, and do you have a suitable source of exposure it?

Our standard exposure light source, a wavelength range of NUV (Near UV) containing I-line, H-line, G-line three beam for your needs.