Automatic mask aligner

24 hours for volume production industries use
產品簡介:

Wafer automatic machines for the automatic transmission input and output, automatic alignment exposure, operating 24 hours a day, to reduce manpower requirements, improve reliability, increase production,
The company developed the high-volume automatic exposure machine, alignment process can produce 250 or more per hour, no registration process can produce 350 or more per hour, the highest yield of the industry, double the other brands models.

 

UV light source models have power 350W, 500W, 1000W, 2000W, 3500W, 5000W
Exposure source size: 4 “, 6”, 8 “, 10″, 12 ”
Wavelength: NUV (including 365nm, 400nm, 435nm),
Half-width parallel light source: 1.5 to 2.5 degrees (depending on the light aperture)
Uniformity: -3 to + 5%
High pressure mercury lamp and power supply

Fixed magnification lens, the pre-Taiwan for one or two shots do coarse positioning, slice into two lenses to do the initial position of the bit, exposing position two shots to do precision alignment.
Recoverable analog camera or digital, can be used day and millions of prime camera, the customized PC’s alignment software do automatic image registration.
Video coaxial lighting with LED light or ring light
Optional on the back of the alignment imaging system models

The substrate may be from the input station for coarse positioning aside, in order to advance to the arm piece to do precision alignment of the alignment station

Small left arm can enter the pre-stage of the substrate is aligned to the station, after the exposure of the substrate to remove the output station

Enter the station by the substrate wafer boat push will spread to the substrate pre Taiwan. Substrate after exposure, introduced by the pilot transmitted to the output station of the wafer boat. The basic move unloading station unfinished

Mask vacuum cups: the suction or downdraft 4 “, 5”, 6 “, 9”
Wafer vacuum cups: 2 ‘, 4’, 6 “, 8”
A mask wafer level correction function
Optional vacuum contact exposure mode with proximity,
X, Y, T axis motor adjustment 10mm. Resolution 1um
Z-axis motor adjustment 5mm, resolution 1um
Open to take place on a reticle substrate
Automatic alignment by self-alignment movement calculation results by the PLC software control adjustment

Automatic alignment software PLC and HMI control systems and industrial computers, the input and output for the substrate and the alignment Exposure Program automatic operation

With four shockproof cushion, with adjustable feet, moving wheels, aluminum extrusion and aluminum frame plus yellow PVC anti-static coating machines, operation and maintenance of a number of open windows and doors and windows

Accuracy and yield depend on the exposure time is different, proximity exposure models fastest up to 5 per minute
Mining vacuum contact exposure pattern analysis within optimum reach 1um
Mining proximity exposure by wafer and reticle pitch is set at about 5 ~ 10um