TSMC named Lei Branch combined attack 7um E-beam solution, a showdown with EUV

TSMC recently named Great American Semiconductor Equipment Business lei (KLA-Tencor) electron beam (E-beam) partners technically one of the devices, in addition to Mapper Lithography and IMS. 7 nm process in the future have the opportunity to pole ultraviolet (EUV) machine for the competition. for 10nm process, TSMC will EUV and Double Patterning with the use of machines in 7nm process, TSMC will make a choice in the EUV and E-beam machine machine table.