Double Exposure Mask Aligner

產品簡介:

Double-sided exposure machine exposure exposure source upper and lower groups, want exposure mask substrate is sandwiched between the upper and lower, while the upper and lower sides of the substrate exposed, on the productivity of the manufacturing process double-sided substrates can be twice the one-sided exposure process.

Ultraviolet light source power 350W or 500W
Exposure source size: 4 “, 5”, 6 “or 8”
Wavelength: NUV (350W at 365nm strength of about 16 ~ 20mW / cm2),
Uniformity: + -5%
Power supply: constant power control
Shutter control timer: 0.1 to 999.9 seconds

With variable magnification lens imaging system, the total image magnification 100X-600X.
Small black and white high-resolution CCD camera, 17 “LCD Screen
LED light source coaxial lighting, the best image resolution of up to 1um
Lens position adjustment, fine tuning can be around, up and down about 20mm,
Choose to use one or both sets imaging system,
Optional quick scan station, you can quickly move the lens moving around about 10cm

Mask vacuum cups: 4 “, 5” or 6 “Downdraft
Wafer vacuum chuck: fragments, 2 “, 3”, 4 “or 5”
Parallel with the mask and the wafer surface correction
Wafer vacuum chuck can be adjusted around, about 10mm, adjust the sensitivity 1um
Rotational adjustment of about 5 degrees to adjust the sensitivity of 0.001
Z-axis adjustable about 3mm, adjust the sensitivity 1um.
Z-axis with a dial gauge displays the mask and wafer spacing
Z-axis can be set to be aligned with the gap between two kinds of exposure
Adjustable contact vacuum suction force size
Exposure modes are Vacuum contact, Soft contact, Proximity
Artificial wafer placement and adjustment of the position of the wafer, the wafer mask when handling sucker open hand

Mining full manual dial button operating system, manual control panel
Switching operations include the replacement of the mask and the wafer, the mask and the wafer gap
The mask and the wafer surface parallel correction in contact with the vacuum switch vacuum value adjustment
Zero Z-axis, around the turn of the lens and the exposure source into alignment with the platform side, and there is a safety interlock feature ..

Desktop large floor stand, with adjustment feet

Mining vacuum contact exposure pattern analysis best reach 1um, proximity exposure mask and the wafer by a gap of up to 3 ~ 5um best