Simple Mask Aligner

產品簡介:

For only the exposure process of the first customers, we launched Easy exposure machine, there is no image registration function, but also to maintain the level of operating and gap adjustment function,

UV light source power 350W, 500W, 1000W, 2000W
Exposure source size: 4 “, 5”, 6 “, 8″, 12 ”
Wavelength: NUV (365nm to 500W 6 “strength of about 16 ~ 20mW / cm2),
Uniformity: + -5%
Power Supply 350W, 500W, 1000W, 2000W

Mask vacuum cups: 4 “, 5”, 7 “, 9” downdraft (option)
Wafer or substrate vacuum cups: fragments, 2 “or 4”, 5 “, 6”, 8 “(option)
A mask and the wafer surface parallel to the substrate or correction
Z-axis adjustable about 5mm, adjust the resolution of 1um.
Z-axis with a dial gauge displays the mask and wafer spacing
Exposure modes are Soft contact, Proximity
Artificial placed the wafer or substrate and adjust the position of the wafer, reticle chuck open up when handling wafers

Mining full manual dial button operating system, manual control panel
Operations include the replacement of the mask and the wafer, the mask and wafer switch parallel surfaces of the mask and the wafer gap correction, in contact with the vacuum switch vacuum value of zero in the Z axis, about the exposure source into alignment station above, and shutter control timer: 0.1 to 999.9 seconds.

With four shockproof cushion, with adjustable feet, moving wheels, stainless steel bracket and disk, desktops and aluminum ribs, adjusting the CDA, the display of a vacuum, and so the power output.

Vacuum pick up optimum contact exposure pattern analysis (positive resist thickness 1um) within 1um
Mining proximity exposure by wafer and reticle sets the optimum spacing of about 3 ~ 5um